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Integrating integrated circuit chips on paper substrates using inkjet printed electronics

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dc.contributor.author Bezuidenhout, Petrone H
dc.contributor.author Land, Kevin J
dc.contributor.author Joubert, T-H
dc.date.accessioned 2017-07-28T09:39:57Z
dc.date.available 2017-07-28T09:39:57Z
dc.date.issued 2016-11
dc.identifier.citation Bezuidenhout, P.H., Land, K.J. and Joubert, T-H. 2016. Integrating integrated circuit chips on paper substrates using inkjet printed electronics. 17th Annual Conference of the Rapid Product Development Association of South Africa (RAPDASA), 2-4 November 2016, Vaal University of Technology en_US
dc.identifier.uri http://conferences.sun.ac.za/index.php/rapdasa17/rapdasa17/paper/view/2532
dc.identifier.uri http://hdl.handle.net/10204/9443
dc.description 17th Annual Conference of the Rapid Product Development Association of South Africa (RAPDASA), 2-4 November 2016, Vaal University of Technology. en_US
dc.description.abstract This paper investigates the integration of silicon and paper substrates using rapid prototyping inkjet printed electronics. Various Dimatix DMP-2831 material printer settings and adhesives are investigated. The aim is to robustly and effectively connect various integrated circuit(IC) chip packages to a paper substrate using a commercially-available conductive silver ink. The verification process included contact resistance compared to line resistance, percentage effective connections, geometry relative to design parameters and frequency characteristics. These parameters are useful in solving integration difficulties and aid the development of electronic networks on paper substrates, providing a clearer understanding of rigid and flexible substrate integration. en_US
dc.language.iso en en_US
dc.relation.ispartofseries Worklist;18268
dc.subject Circuit chips en_US
dc.subject Inkjet printed electronics en_US
dc.subject Dimatix DMP-2831 material en_US
dc.title Integrating integrated circuit chips on paper substrates using inkjet printed electronics en_US
dc.type Conference Presentation en_US
dc.identifier.apacitation Bezuidenhout, P. H., Land, K. J., & Joubert, T. (2016). Integrating integrated circuit chips on paper substrates using inkjet printed electronics. http://hdl.handle.net/10204/9443 en_ZA
dc.identifier.chicagocitation Bezuidenhout, Petrone H, Kevin J Land, and T-H Joubert. "Integrating integrated circuit chips on paper substrates using inkjet printed electronics." (2016): http://hdl.handle.net/10204/9443 en_ZA
dc.identifier.vancouvercitation Bezuidenhout PH, Land KJ, Joubert T, Integrating integrated circuit chips on paper substrates using inkjet printed electronics; 2016. http://hdl.handle.net/10204/9443 . en_ZA
dc.identifier.ris TY - Conference Presentation AU - Bezuidenhout, Petrone H AU - Land, Kevin J AU - Joubert, T-H AB - This paper investigates the integration of silicon and paper substrates using rapid prototyping inkjet printed electronics. Various Dimatix DMP-2831 material printer settings and adhesives are investigated. The aim is to robustly and effectively connect various integrated circuit(IC) chip packages to a paper substrate using a commercially-available conductive silver ink. The verification process included contact resistance compared to line resistance, percentage effective connections, geometry relative to design parameters and frequency characteristics. These parameters are useful in solving integration difficulties and aid the development of electronic networks on paper substrates, providing a clearer understanding of rigid and flexible substrate integration. DA - 2016-11 DB - ResearchSpace DP - CSIR KW - Circuit chips KW - Inkjet printed electronics KW - Dimatix DMP-2831 material LK - https://researchspace.csir.co.za PY - 2016 T1 - Integrating integrated circuit chips on paper substrates using inkjet printed electronics TI - Integrating integrated circuit chips on paper substrates using inkjet printed electronics UR - http://hdl.handle.net/10204/9443 ER - en_ZA


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